4. Electricity: conductors and insulators
  5. Conduits, cables or conductors
  6. Preformed panel circuit arrangement

Larry L. Moresco

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Apparatus for cooling semiconductor chips in multichip modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Controlled impedance interposer substrate and method of making

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent

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Controlled impedence interposer substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Controlling the heat expansion of electrical couplings

Stock material or miscellaneous articles – Structurally defined web or sheet – Including grain – strips – or filamentary elements in...
Reexamination Certificate

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Diffusion bonded interconnect

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Patent

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Profile ID: LFUS-PAI-P-149877

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