Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1995-05-11
1998-02-10
Breneman, R. Bruce
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
20429807, 20429832, 20429833, 118723E, 118715, C23F 102, C23C 1434, C23C 1600
Patent
active
057164843
ABSTRACT:
A plasma etch chamber includes a modified focus ring which is used in conjunction with chamber pressure throttling to eject contaminants in the focus ring away from the substrate just before the etching cycle is completed. Additionally, process gas is directed against the inner wall of the chamber to create a swirling flow of plasma within the chamber and thus disturb any contaminant-generating field adjacent the chamber wall. A process gas, or a non-reactive purge gas, may also be supplied from a diffuser atop the cathode, to direct a gas layer along the top and sides of the chamber to reduce contaminant build-up on the chamber surfaces.
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Blackburn Greg
Kava Joseph
McGovern Richard
Rozenzon Yan
Applied Materials Inc.
Breneman R. Bruce
McDonald Rodney G.
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