Abrading – Flexible-member tool – per se
Reexamination Certificate
2006-06-27
2006-06-27
Thomas, David B. (Department: 3723)
Abrading
Flexible-member tool, per se
C451S529000, C451S288000
Reexamination Certificate
active
07066800
ABSTRACT:
An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.
REFERENCES:
patent: 3162588 (1964-12-01), Bell
patent: 3873512 (1975-03-01), Latanision
patent: 4125444 (1978-11-01), Inoue
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 4934102 (1990-06-01), Leach et al.
patent: 4954141 (1990-09-01), Takiyama et al.
patent: 5136817 (1992-08-01), Tabata et al.
patent: 5217586 (1993-06-01), Datta et al.
patent: 5225034 (1993-07-01), Yu et al.
patent: 5534106 (1996-07-01), Cote et al.
patent: 5543032 (1996-08-01), Datta et al.
patent: 5562529 (1996-10-01), Kishii et al.
patent: 5567300 (1996-10-01), Datta et al.
patent: 5575706 (1996-11-01), Tsai et al.
patent: 5578362 (1996-11-01), Reinhardt et al.
patent: 5624300 (1997-04-01), Kishii et al.
patent: 5804507 (1998-09-01), Perlov et al.
patent: 5807165 (1998-09-01), Uzoh et al.
patent: 5823854 (1998-10-01), Chen
patent: 5846882 (1998-12-01), Birang
patent: 5871392 (1999-02-01), Meikle et al.
patent: 5911619 (1999-06-01), Uzoh et al.
patent: 5938801 (1999-08-01), Robinson
patent: 5985093 (1999-11-01), Chen
patent: 6001008 (1999-12-01), Fujimori et al.
patent: 6004880 (1999-12-01), Liu et al.
patent: 6017265 (2000-01-01), Cook et al.
patent: 6020264 (2000-02-01), Lustig et al.
patent: 6024630 (2000-02-01), Shendon et al.
patent: 6056851 (2000-05-01), Hsieh et al.
patent: 6066030 (2000-05-01), Uzoh
patent: 6090239 (2000-07-01), Liu et al.
patent: 6103096 (2000-08-01), Datta et al.
patent: 6116998 (2000-09-01), Damgaard et al.
patent: 6153043 (2000-11-01), Edelstein et al.
patent: 6156124 (2000-12-01), Tobin
patent: 6159079 (2000-12-01), Zuniga et al.
patent: 6171467 (2001-01-01), Weihs et al.
patent: 6176992 (2001-01-01), Talieh
patent: 6190494 (2001-02-01), Dow
patent: 6210257 (2001-04-01), Carlson
patent: 6234870 (2001-05-01), Uzoh et al.
patent: 6238271 (2001-05-01), Cesna
patent: 6244935 (2001-06-01), Birang et al.
patent: 6248222 (2001-06-01), Wang
patent: 6273798 (2001-08-01), Berman
patent: 6297159 (2001-10-01), Paton
patent: 6319420 (2001-11-01), Dow
patent: 6331135 (2001-12-01), Sabde et al.
patent: 6368184 (2002-04-01), Beckage
patent: 6381169 (2002-04-01), Bocian et al.
patent: 6386956 (2002-05-01), Sato et al.
patent: 6391166 (2002-05-01), Wang
patent: 6395152 (2002-05-01), Wang
patent: 6440295 (2002-08-01), Wang
patent: 6482307 (2002-11-01), Ashjaee et al.
patent: 6497800 (2002-12-01), Talieh et al.
patent: 2001/0024878 (2001-09-01), Nakamura
patent: 2001/0036746 (2001-11-01), Sato et al.
patent: 2001/0040100 (2001-11-01), Wang
patent: 2001/0042690 (2001-11-01), Talieh et al.
patent: 2002/0008036 (2002-01-01), Wang
patent: 2002/0070126 (2002-06-01), Sato et al.
patent: 2002/0077037 (2002-06-01), Tietz
patent: 325753 (1989-08-01), None
patent: 11042554 (1999-02-01), None
patent: P2001-77117 (2001-04-01), None
patent: 1618538 (1991-01-01), None
patent: 98/49723 (1998-11-01), None
patent: WO 99/41434 (1999-08-01), None
patent: WO 99/53119 (1999-10-01), None
patent: WO 99/65072 (1999-12-01), None
patent: WO 00/03426 (2000-01-01), None
patent: WO 00/264443 (2000-05-01), None
patent: WO 00/33356 (2000-06-01), None
patent: WO 00/59682 (2000-10-01), None
patent: WO 01/49452 (2001-07-01), None
patent: WO 02/23616 (2002-03-01), None
patent: WO 02/064314 (2002-08-01), None
Partial International Search/PCT Invitation to Pay Additional Fees (PCT Article 17(3)(a) and Rule 40.1).
PCT Search Report dated Feb. 25, 2003 for PCT/US02/11009.
Nogami;An Annovation to Integrate Porous Low-k Materials and Copper; Interconnect Japan 2001; Honeywell Seminar Dec. 6, 2001; pp. 1-12.
PCT Written Opinion for International Application US/02/11009 dated Apr. 10, 2002.
U.S. patent application 10/038,066 filed Jan. 03, 2002.
U.S. patent application 10/151,538 filed May 16, 2002.
U.S. patent application 10/141,459 filed May 7, 2002.
Communication pursuant to Article 96(2) EPC for Application No. 02728965.4, dated Jun. 11, 2004 (AMAT/4100.EP).
European Search Report dated Sep. 27, 2005 for Application No. 03254807.5 (APPM/004100.P2(Y3)).
Birang Manoocher
Butterfield Paul D.
Carl Daniel A.
Chen Liang-Yuh
Duboust Alain
Applied Materials Inc.
Patterson & Sheridan
Thomas David B.
LandOfFree
Conductive polishing article for electrochemical mechanical... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Conductive polishing article for electrochemical mechanical..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive polishing article for electrochemical mechanical... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3681232