Composition for forming a photosensitive organic...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S313000, C430S271100, C430S272100, C430S280100

Reexamination Certificate

active

07655389

ABSTRACT:
A composition for forming a photosensitive organic anti-reflective layer includes about 0.5 to about 5 percent by weight of an acid-labile thermal cross-linking agent that is decomposed by an epoxy group and a photo-acid generator, about 10 to about 22 percent by weight of a copolymer resin that includes an acrylate monomer containing anthracene or a methacrylate monomer containing anthracene, about 0.1 to about 1 percent by weight of a photo-acid generator, and a solvent.

REFERENCES:
patent: 5886102 (1999-03-01), Sinta et al.
patent: 5919599 (1999-07-01), Meador et al.
patent: 6054254 (2000-04-01), Sato et al.
patent: 6872506 (2005-03-01), Neef et al.
patent: 2003/0166828 (2003-09-01), Cox et al.
patent: 2003/0213968 (2003-11-01), Sivakumar
patent: 2003/0215736 (2003-11-01), Oberlander et al.
patent: 2004/0077173 (2004-04-01), Sivakumar
patent: 2005/0074699 (2005-04-01), Sun et al.
patent: 2005/0148170 (2005-07-01), Bhave et al.
patent: 2005/0255410 (2005-11-01), Guerrero et al.
patent: 351458 (2002-08-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Composition for forming a photosensitive organic... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Composition for forming a photosensitive organic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composition for forming a photosensitive organic... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4227458

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.