Composite stress spacer

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C438S230000, C438S231000, C257SE21637

Reexamination Certificate

active

11122667

ABSTRACT:
An example method embodiment forms spacers that create tensile stress on the substrate on both the PFET and NFET regions. We form PFET and NFET gates and form tensile spacers on the PFET and NFET gates. We implant first ions into the tensile PFET spacers to form neutralized stress PFET spacers. The neutralized stress PFET spacers relieve the tensile stress created by the tensile stress spacers on the substrate. This improves device performance.

REFERENCES:
patent: 4966663 (1990-10-01), Mauger
patent: 6191462 (2001-02-01), Chen-Hua
patent: 6512273 (2003-01-01), Krivokapic et al.
patent: 6573172 (2003-06-01), En et al.
patent: 6825529 (2004-11-01), Chidambarrao et al.
patent: 6902971 (2005-06-01), Grudowski
patent: 2003/0040158 (2003-02-01), Saitoh
patent: 2004/0104405 (2004-06-01), Huang et al.
patent: 2004/0113217 (2004-06-01), Chidambarrao et al.
patent: 2004/0132249 (2004-07-01), Mitsuda et al.
patent: 2004/0191975 (2004-09-01), Weber et al.
patent: 2004/0262784 (2004-12-01), Doris et al.

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