Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1995-12-27
1998-05-12
Lorin, Francis J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
29827, 29831, 1562757, 156295, 156312, 438119, 438125, H05K 330, C09J 902, H01L 23485, H01R 404
Patent
active
057499977
ABSTRACT:
This invention provides a bonded structure and a method of forming the bonded structure for joining a lead array to the conducting bonding pads of an integrated circuit element. The invention uses an anisotropic conductive film with tape automated bonding to form the bonded structure. The invention also uses integrated circuit elements having composite bumps as input/output pads. The composite bumps comprise a polymer body covered by a conductive metal coating. The invention provides a low cost method of tape automated bonding which uses lower temperature and pressure in the bonding process and provides a bond which is automatically encapsulated after the bonding has been completed. The lower temperature and pressure improve the dimensional stability of the elements of the bonded structure and the automatic encapsulation provides improved reliability.
REFERENCES:
patent: 4731282 (1988-03-01), Tsukagoshi et al.
patent: 4740657 (1988-04-01), Tsukagoshi et al.
patent: 4963002 (1990-10-01), Tagusa et al.
patent: 5001542 (1991-03-01), Tsukagoshi et al.
Chang Shyh-Ming
Fang Su-Yu
Lee Yu-Chi
Tang Pao-Yun
Ackerman Stephen B.
Industrial Technology Research Institute
Lorin Francis J.
Prescott Larry J.
Saile George O.
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