4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Philip Osborn

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Components, methods and assemblies for multi-chip packages

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Method of manufacturing a plurality of semiconductor packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2059062

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