Combined NMOS and SCR ESD protection device

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257361, 257362, H01L 2362

Patent

active

060668792

ABSTRACT:
A device layout is disclosed for an ESD device for protecting NMOS or Drain-Extended (DENMOS) high power transistors where the protection device (an SCR) and the NMOS or DENMOS transistors are integrated saving on silicon real estate. The integration is made possible by adding a p.sup.+ diffusion to the n-well (drain) of a high power NMOS (DENMOS) transistor such that the added p.sup.+ diffusion together with the aforementioned n-well and the p-substrate of the silicon wafer create one of the two transistors of the SCR. A low triggering voltage of the SCR is achieved by having the second parasitic npn transistor of the SCR in parallel with the NMOS (DENMOS) transistor by sharing the n-well (collector/drain), p-substrate (base/channel region), and an adjacent n.sup.+ diffusion (emitter/source) in the p-substrate. A high HBM ESD Passing Voltage is obtained by utilizing the tank oxide method of a DENMOS transistor.

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Duvvury et al., "Device Integration for ESD Robustness of High Voltage Power MOSFETs", IEEE (1994), pp. 407-410.

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