Colors only process to reduce package yield loss

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S098000, C257S292000, C257SE21185, C257SE21189, C257SE27134, C257SE27142

Reexamination Certificate

active

07485906

ABSTRACT:
Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon. A transparent encapsulant is deposited to planarize the color filter layer and completes the solid-state color image-forming device without conventional convex microlenses.

REFERENCES:
patent: 4870268 (1989-09-01), Vincent et al.
patent: 5595930 (1997-01-01), Baek
patent: 5672519 (1997-09-01), Song et al.
patent: 5691548 (1997-11-01), Akio
patent: 5693967 (1997-12-01), Park et al.
patent: 5796154 (1998-08-01), Sano et al.
patent: 5844290 (1998-12-01), Furumiya
patent: 5976907 (1999-11-01), Shigeta et al.
patent: 6040591 (2000-03-01), Otsuka
patent: 6091093 (2000-07-01), Kang et al.
patent: 6171883 (2001-01-01), Fan et al.
patent: 6171885 (2001-01-01), Fan et al.
patent: 6482669 (2002-11-01), Fan et al.
patent: 6682659 (2004-01-01), Cho et al.

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