Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – Having specific type of active device
Reexamination Certificate
2006-04-19
2008-08-12
Sarkar, Asok K (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Gate arrays
Having specific type of active device
C257SE27108
Reexamination Certificate
active
07411227
ABSTRACT:
The present invention provides a complementary metal oxide semiconductor integration process whereby a plurality of silicided metal gates are fabricated atop a gate dielectric. Each silicided metal gate that is formed using the integration scheme of the present invention has the same silicide metal phase and substantially the same height, regardless of the dimension of the silicide metal gate. The present invention also provides various methods of forming a CMOS structure having silicided contacts in which the polySi gate heights are substantially the same across the entire surface of a semiconductor structure.
REFERENCES:
patent: 4780429 (1988-10-01), Roche et al.
patent: 5986313 (1999-11-01), Ueda et al.
patent: 6022769 (2000-02-01), Wu
patent: 6100145 (2000-08-01), Kepler et al.
patent: 6124610 (2000-09-01), Cheek et al.
patent: 6153485 (2000-11-01), Pey et al.
patent: 6238982 (2001-05-01), Krivokapic et al.
patent: 6281558 (2001-08-01), Sayama et al.
patent: 6426524 (2002-07-01), Lam et al.
patent: 6458702 (2002-10-01), Aloni
patent: 6596576 (2003-07-01), Fu et al.
patent: 6656764 (2003-12-01), Wang
patent: 6787464 (2004-09-01), Cheek et al.
patent: 6867130 (2005-03-01), Karlsson et al.
patent: 6924184 (2005-08-01), Cave et al.
patent: 6974729 (2005-12-01), Collaert et al.
patent: 2002/0123122 (2002-09-01), Wu
patent: 2002/0123222 (2002-09-01), Wu
patent: 2003/0141565 (2003-07-01), Hirose et al.
patent: 2003/0230811 (2003-12-01), Kim
patent: 2005/0074932 (2005-04-01), Lin et al.
patent: 2 804 793 (2001-08-01), None
patent: 2002-217411 (2002-08-01), None
patent: WO 99/53535 (1999-10-01), None
Oh J. et al. “Interdigitated Ge p-i-n Photodetectors Fabricated on a Si Substrate Using Graded SiGe Buffer Layers.”IEEE Journal of Quantum Electronics,vol. 38, No. 9, (2002).
Jones R.E. et al. “Fabrication and Modeling of Gigahertz Photodetectors in Heteroepitaxial Ge-on-Si Using a Graded Buffer Layer Deposited by Low Energy Plasma Enhanced CVD.”IEDMp. 793 (2002).
“Self-Aligned Technique Employing Planarized Resist For Reducing Poly-Silicon Sheet Resistance By Formation of a Metal Silicide.” IBM Technical Disclosure Bulletin, IBM Corp. vol. 30 No. 5 (1987).
Shyam P. Murarka; “Recent Advances in Silicide Technology” Solid State Technology; Sep. 1985, pp. 181-185.
Dennis R. Nichols; “Anti-fuse Metal Silicide for Manufacturing Silicon Chip”; Microelectronics Manufacturing and Testing; vol. 2, 1983.
Amos Ricky S.
Boyd Diane C.
Cabral, Jr. Cyril
Kaplan Richard D.
Kedzierski Jakub T.
International Business Machines - Corporation
Sarkar Asok K
Scully , Scott, Murphy & Presser, P.C.
Trepp, Esq. Robert M.
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