Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1994-01-21
1995-08-01
Breneman, R. Bruce
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
118728, 20429815, C23F 102
Patent
active
054377579
ABSTRACT:
A clamp ring for use in a thermal reactor for processing a semiconductor wafer. The reactor includes a domed pedestal for supporting the wafer and controlling its temperature, and a clamp ring which includes an annular seat formed therein, for receiving and holding down the periphery of the wafer onto the domed pedestal. The seat formed in the clamp ring supports a ring of spheres which, in operation, engage and hold down the periphery of the wafer. Each sphere is rotationally supported in a pocket formed in the body of the clamp ring. A portion of each sphere protrudes beyond the seat so that the wafer's surface is contacted by the convex surface of the sphere. This keeps the wafer's surface and any sharp edges on the seat apart, thereby reducing damage of the wafer's surface by the seat. As the spheres are able to rotate in the pockets and therefore roll on the surface of the wafer, the chances of the damaging the wafer's surface are further reduced.
REFERENCES:
patent: 4978412 (1990-12-01), Aoki
patent: 5124019 (1992-06-01), Kunkel
patent: 5203958 (1993-04-01), Arai
patent: 5268067 (1993-12-01), Dostalik
patent: 5304248 (1994-04-01), Cheng
Mohn Jon
Rice Michael
Applied Materials Inc.
Breneman R. Bruce
Chang Joni Y.
Opperman Craig P.
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