4. Locks
  5. Special application
  6. For closures

Kun-Chen Tsai

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Circuit barrier structure of semiconductor packaging...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Door lock

Locks – Special application – For closures
Reexamination Certificate

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Method of fabricating electrical connection terminal of...

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Semiconductor package substrate having contact pad...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Semiconductor package substrate having contact pad...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2608362

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