4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Integrated circuit structure with electrically isolated...
  6. Passive components in ics

William F. Nixon

Attorney

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Circuit barrier structure of semiconductor packaging...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Cuvette and cuvette cap

Optics: measuring and testing – Sample – specimen – or standard holder or support – Fluid containers
Reexamination Certificate

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Direct connection multi-chip semiconductor element structure

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Flexible landscape edging

Building units and construction elements – Architectural stock material – Elongated
Design Patent

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Method for fabricating conductive bump of circuit board

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2369672

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