Chlorine reduction module

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156345, 1566431, 216 63, 216 66, 134 13, H01L 2100

Patent

active

057140367

ABSTRACT:
A programmable halogen lamp assembly radiantly heats a post-etch wafer in a semiconductor wafer processing environment to evolve corrosive, chlorine based compounds that reside on or in the processed wafer, preferably during wafer unloading to minimize throughput loss, and preferably under vacuum to prevent the onset of a corrosion reaction.

REFERENCES:
patent: 5300187 (1994-04-01), Lesk et al.
patent: 5352327 (1994-10-01), Witowski

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