Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1995-07-28
1998-02-03
Powell, William
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156345, 1566431, 216 63, 216 66, 134 13, H01L 2100
Patent
active
057140367
ABSTRACT:
A programmable halogen lamp assembly radiantly heats a post-etch wafer in a semiconductor wafer processing environment to evolve corrosive, chlorine based compounds that reside on or in the processed wafer, preferably during wafer unloading to minimize throughput loss, and preferably under vacuum to prevent the onset of a corrosion reaction.
REFERENCES:
patent: 5300187 (1994-04-01), Lesk et al.
patent: 5352327 (1994-10-01), Witowski
Rozenzon Yan
Schmidt Jeffrey
Wong George
Applied Materials Inc.
Glenn Michael A.
Powell William
Sgarbossa Peter J.
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