Chemical mechanical polishing pad for controlling polishing...

Details Chemical mechanical polishing pad for controlling polishing... Chemical mechanical polishing pad for controlling polishing...

2007-02-27

2007-02-27

Ackun, Jr., Jacob K. (Department: 3723)

Abrading

Machine

Rotary tool

C451S527000, C451S530000, C051S297000

Reexamination Certificate

active

11036903

ABSTRACT:
A polishing pad for a chemical mechanical polishing apparatus has a body with a polishing surface having a radius, a central region, and a peripheral region. The polishing surface has a plurality of main radial-line channels extending radially outwardly from the central region to the peripheral region, each main radial-line channel having an angled outer segment at the peripheral region that is directed at an angle relative to a radius of the polishing surface. The polishing surface also has a plurality of primary tributary radial-line channels that are each connected by an angled transition segment to a main radial-line channel, the tributary radial-line channels being spaced apart from the main radial-line channels. The polishing pad provides an improved distribution and flow of polishing slurry during a polishing process.

REFERENCES:
patent: 5257478 (1993-11-01), Hyde et al.
patent: 5489233 (1996-02-01), Cook et al.
patent: 5578362 (1996-11-01), Reinhardt et al.
patent: 5605760 (1997-02-01), Roberts
patent: 5650039 (1997-07-01), Talieh
patent: 5882251 (1999-03-01), Berman et al.
patent: 5921855 (1999-07-01), Osterfield et al.
patent: 5984769 (1999-11-01), Bennett et al.
patent: 6159088 (2000-12-01), Nakajima
patent: 6217426 (2001-04-01), Tolles et al.
patent: 6575825 (2003-06-01), Tolles et al.
patent: 6843711 (2005-01-01), Muldowney
patent: 6955587 (2005-10-01), Muldowney
patent: 6958002 (2005-10-01), Palaparthi

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