Chemical mechanical polishing a substrate having a filler...

Details Chemical mechanical polishing a substrate having a filler... Chemical mechanical polishing a substrate having a filler...

2005-03-08

2005-03-08

Ostrager, Allen (Department: 3725)

Abrading

Abrading process

Utilizing fluent abradant

C451S041000

Reexamination Certificate

active

06863593

ABSTRACT:
A substrate is chemical mechanical polished with a high-selectivity slurry until the stop layer is at least partially exposed, and then the substrate is polished with a low-selectivity slurry until the stop layer is completely exposed.

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