Cathode liner with wafer edge gas injection in a plasma...

Coating apparatus – Gas or vapor deposition – With treating means

Reexamination Certificate

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C118S728000

Reexamination Certificate

active

07832354

ABSTRACT:
The disclosure concerns a wafer support for use in a plasma reactor chamber, in which the wafer support has a wafer edge gas injector adjacent and surrounding the wafer edge.

REFERENCES:
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patent: 2007/0193688 (2007-08-01), Dhindsa et al.
U.S. Appl. No. 11/899,613, filed Sep. 5, 2007, Katz et al.
Official Action Dated May 17, 2010 Issued in Co-Pending U.S. Appl. No. 11/899,613.

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