Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2006-08-01
2006-08-01
Rollington, Jermele (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
Reexamination Certificate
active
07084655
ABSTRACT:
A forced air heat exhaust type of burn-in test apparatus for packages: A first air supply duct provides air to the burn-in chamber and a second air supply duct provides air to supply tubes that direst air into the test sockets that hold the packages. The test sockets have a structure that allows air ventilation of the conductive balls. Accordingly, the apparatus can control the temperature around the packages as well as the temperature in the burn-in chamber, thus preventing conductive ball-melting.
REFERENCES:
patent: 5851143 (1998-12-01), Hamid
patent: 6353329 (2002-03-01), Kiffe
patent: 6861861 (2005-03-01), Song et al.
patent: 59-057463 (1984-04-01), None
patent: 63-005282 (1988-01-01), None
patent: 2001-004693 (2001-01-01), None
patent: 1999-013983 (1999-04-01), None
English language abstract of Korean Publication No. 1999-013983.
English language abstract of Japanese Publication No. 2001-004693.
English language abstract of Japanese Publication No. 59-057463.
English language abstract of Japanese Publication No. 63-005282.
Bang Jeong-Ho
Iy Hyun-Geun
Kim Woo-Jin
Lee Jae-Il
Min Byung-Jun
Marger & Johnson & McCollom, P.C.
Nguyen Tung X.
Rollington Jermele
Samsung Electronics Co,. Ltd.
LandOfFree
Burn-in test apparatus for BGA packages using forced heat... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Burn-in test apparatus for BGA packages using forced heat..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Burn-in test apparatus for BGA packages using forced heat... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3654147