Micro corner cube array, method of making the micro corner...

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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C438S713000, C438S718000, C438S719000, C252S079100, C216S002000, C216S041000, C216S058000, C216S074000, C216S079000, C216S080000

Reexamination Certificate

active

07098137

ABSTRACT:
A method of making a micro corner cube array includes the steps of: providing a substrate, at least a surface portion of which consists of cubic single crystals and which has a surface that is substantially parallel to {111} planes of the crystals; and dry-etching the surface of the substrate anisotropically with an etching gas that is reactive with the substrate, thereby forming a plurality of unit elements of the micro corner cube array on the surface of the substrate. Each of the unit elements is made up of a number of crystal planes that have been etched at a lower etch rate than the {111} planes of the crystals.

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