4. Cleaning and liquid contact with solids
  5. Apparatus
  6. With plural means for supplying or applying different fluids...

Szu-Yao Wang

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Bump reflow method by inert gas plasma

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Bumping process

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Filler for airtight container

Fluid handling – Systems – System with plural openings – one a gas vent or access opening
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Flush system for dry film photoresist remover

Cleaning and liquid contact with solids – Processes – Hollow work – internal surface treatment
Reexamination Certificate

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Method of drying wafers

Drying and gas or vapor contact with solids – Material treated by electromagnetic energy – Microwave energy
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Profile ID: LFUS-PAI-P-2435058

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