4. Material or article handling
  5. Device for emptying portable receptacle
  6. Nongravity type

Hirofumi Moroe

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Apparatus for positioning a semiconductor pellet

Work holders – With fluid means – Vacuum-type holding means
Reexamination Certificate

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Bump bonding apparatus

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces
Reexamination Certificate

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Bump forming method

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Method and apparatus for positioning a semiconductor pellet

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Method for forming pin-form wires and the like

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1473748

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