Buffer station for wafer backside cleaning and inspection

Details Buffer station for wafer backside cleaning and inspection Buffer station for wafer backside cleaning and inspection

2005-05-31

2005-05-31

Everhart, Caridad (Department: 2825)

Semiconductor device manufacturing: process

Chemical etching

Having liquid and vapor etching steps

C438S014000, C118S050100, C118S075000, C356S237300

Reexamination Certificate

active

06900135

ABSTRACT:
A wafer processing station includes an air gap chuck and a light emitter/collector assembly configured to gather light when scattered or reflected by contaminants on the wafer. The light emitter/collector assembly is driven by an actuator so that it passes across a backside surface of a wafer when supported within the chuck during wafer inspection. The wafer processing station may also include a cleaning module configured to clean the backside surface of the wafer when contaminants are discovered during wafer inspection. A computer system may be coupled to receive one or more signals from the light emitter/collector assembly that are indicative of contaminants on the backside surface of the wafer and to provide one or more control signals to the cleaning module in accordance therewith. The cleaning module may be used independently of the light emitter/collector assembly and vice-versa.

REFERENCES:
patent: 5930586 (1999-07-01), Jain et al.
patent: 5963315 (1999-10-01), Hiatt et al.
patent: 6747464 (2004-06-01), Blackwood
patent: 2002/0074512 (2002-06-01), Montagu et al.
“Programmable z stage” IBM Technical Disclosure Bulletin,NA81123436, vol. 24, No. 7A(Dec. 1981)p. 3436.*
“Event-Discriminating Algorithm-Automatic Defect/Particulate Detection System” IBM Technical Disclosure Bulletin,NN85057143, vol. 27, No. 12 (May 1985) pp-7143-7148).

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