Blending integrated circuit technology

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438253, 438257, 438258, 438199, H01L 218242

Patent

active

057029881

ABSTRACT:
A method of forming semiconductor logic devices and memory devices on a single semiconductor substrate is described. Memory devices that may be formed include nonvolatile memory, DRAM and/or SRAM (poly-load or TFT). A semiconductor substrate having a first conductivity type dopant is provided. A triple-well structure is formed in the semiconductor substrate, having N-well regions, P-well regions, and P-well in N-well regions. Field isolation regions are formed. A cell is formed for each memory device in the memory regions. A channel implant is performed in the substrate for each of the logic and memory devices. A primary gate and gate oxide is formed for each of the logic and memory devices. LDD (Lightly Doped Drain) active regions and heavily doped source/drain regions are formed adjacent to each gate. Additional memory structures are formed, such as a DRAM capacitor. An interlevel dielectric and contact openings therein are formed. One or more metal layers are subsequently deposited over the inter-level dielectric layer and in the openings to make contact to the contact regions.

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patent: 5340762 (1994-08-01), Vora
patent: 5547893 (1996-08-01), Sung
S. Wolf, "Silicon Processing for the VLSI Era-vol. 2" Lattice Press, Sunset Beach, CA, pp. 571-572, 1990.

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