Baking of photoresist on wafers

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Post imaging radiant energy exposure

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430330, 427512, 427510, 427521, G03C 500

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active

058495827

ABSTRACT:
A method and apparatus for curing a photoresist that is deposited in liquid form and spun on a surface of a wafer leaving a thin film to be cured. This invention teaches methods for curing the resist with improved thickness control using front side heating.

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patent: 5306653 (1994-04-01), Hur
patent: 5431700 (1995-07-01), Sloan
patent: 5620560 (1997-04-01), Akimoto et al.
patent: 5626782 (1997-05-01), Maeda

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