Atomic layer deposition of interpoly oxides in a...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S211000, C438S216000, C438S264000, C438S785000

Reexamination Certificate

active

07122415

ABSTRACT:
Aluminum oxide is deposited by atomic layer deposition to form a high-k dielectric for the interpoly dielectric layer of a non-volatile memory device. The increased capacitive coupling can allow a thicker oxide layer to be used between the floating gate and the control gate, resulting in improved reliability and longer lifetime of the memory cells fabricated according to this invention.

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Brown, William D. & Brewer, Joe E. “Nonvolatile Semiconductor Memory Technology: A Comprehensive Guide to Understanding and Using NVSM Devices” pp. 10-25; The Institute of Electrical and Electronics Engineers, Inc., New York.

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