Atomic layer deposition method

Single-crystal – oriented-crystal – and epitaxy growth processes; – Forming from vapor or gaseous state – With decomposition of a precursor

Reexamination Certificate

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C117S092000, C117S093000

Reexamination Certificate

active

07128787

ABSTRACT:
An atomic layer deposition method includes positioning a semiconductor substrate within an atomic layer deposition chamber. A first precursor gas is flowed to the substrate within the atomic layer deposition chamber effective to form a first monolayer on the substrate. After forming the first monolayer, a reactive intermediate gas is flowed to the substrate within the deposition chamber. The reactive intermediate gas is capable of reaction with an intermediate reaction by-product from the first precursor flowing under conditions of the reactive intermediate gas flowing. After flowing the reactive intermediate gas, a second precursor gas is flowed to the substrate within the deposition chamber effective to form a second monolayer on the first monolayer. Other aspects and implementations are contemplated.

REFERENCES:
patent: 5879459 (1999-03-01), Gadgil et al.
patent: 5925411 (1999-07-01), van de Ven et al.
patent: 5972430 (1999-10-01), DiMeo, Jr. et al.
patent: 6015597 (2000-01-01), David
patent: 6174377 (2001-01-01), Doering et al.
patent: 6197120 (2001-03-01), David
patent: 6200893 (2001-03-01), Sneh
patent: 6270572 (2001-08-01), Kim et al.
patent: 6287965 (2001-09-01), Kang et al.
patent: 6301434 (2001-10-01), McDiarmid et al.
patent: 6305314 (2001-10-01), Sneh et al.
patent: 6355561 (2002-03-01), Sandhu et al.
patent: 6387185 (2002-05-01), Doering et al.
patent: 6391785 (2002-05-01), Satta et al.
patent: 6403156 (2002-06-01), Jang et al.
patent: 6426307 (2002-07-01), Lim
patent: 6451119 (2002-09-01), Sneh et al.
patent: 6451695 (2002-09-01), Sneh
patent: 6468924 (2002-10-01), Lee et al.
patent: 6475276 (2002-11-01), Elers et al.
patent: 6475286 (2002-11-01), Frijlink
patent: 6475910 (2002-11-01), Sneh
patent: 6482262 (2002-11-01), Elers et al.
patent: 6482476 (2002-11-01), Liu
patent: 6534395 (2003-03-01), Werkhoven et al.
patent: 6585823 (2003-07-01), Van Wijck
patent: 6586343 (2003-07-01), Ho et al.
patent: 6589886 (2003-07-01), Kim et al.
patent: 6590251 (2003-07-01), Kang et al.
patent: 6602784 (2003-08-01), Sneh
patent: 6613587 (2003-09-01), Carpenter et al.
patent: 6620253 (2003-09-01), Dando et al.
patent: 6620723 (2003-09-01), Byun et al.
patent: 6630401 (2003-10-01), Sneh
patent: 6638862 (2003-10-01), Sneh
patent: 6664192 (2003-12-01), Satta et al.
patent: 6673701 (2004-01-01), Marsh et al.
patent: 6696157 (2004-02-01), David et al.
patent: 6696368 (2004-02-01), Derraa et al.
patent: 6720027 (2004-04-01), Yang et al.
patent: 6727169 (2004-04-01), Raaijmakers et al.
patent: 6746952 (2004-06-01), Derraa et al.
patent: 6753271 (2004-06-01), Sarigiannis et al.
patent: 6821347 (2004-11-01), Carpenter et al.
patent: 2001/0024387 (2001-09-01), Raaijmakers et al.
patent: 2001/0041250 (2001-11-01), Werkhoven et al.
patent: 2001/0050039 (2001-12-01), Park
patent: 2001/0054381 (2001-12-01), Umotoy et al.
patent: 2002/0086111 (2002-07-01), Byun et al.
patent: 2002/0108714 (2002-08-01), Doering et al.
patent: 2002/0187256 (2002-12-01), Elers et al.
patent: 2003/0031807 (2003-02-01), Elers et al.
patent: 2003/0032281 (2003-02-01), Werkhoven et al.
patent: 2003/0085424 (2003-05-01), Bryant et al.
patent: 2003/0108674 (2003-06-01), Chung et al.
patent: 2003/0129826 (2003-07-01), Werkhoven et al.
patent: 2003/0143328 (2003-07-01), Chen et al.
patent: 2003/0183171 (2003-10-01), Sneh et al.
patent: 2004/0033688 (2004-02-01), Sarigiannis et al.
patent: 2004/0083959 (2004-05-01), Carpenter et al.
patent: 2004/0137728 (2004-07-01), Gallagher et al.
patent: 2005/0037597 (2005-02-01), Nguyen et al.
patent: WO 01/27347 (2001-04-01), None
patent: WO 01/29280 (2001-04-01), None
patent: WO 01/29893 (2001-04-01), None
patent: WO 01/29893 (2001-04-01), None
patent: WO 01/66832 (2001-09-01), None
patent: PCT/US03/22804 (2003-12-01), None
U.S. Appl. No. 10/132,003, filed Apr. 2002, Dando et al.
U.S. Appl. No. 10/132,767, filed Apr. 2002, Dando et al.
U.S. Appl. No. 10/150,388, filed May. 2002, Mardian et al.
U.S. Appl. No. 10/163,689, filed Jun. 2002, Derderian et al.
U.S. Appl. No. 10/208,314, filed Jul. 2002, Castrovillo et al.
U.S. Appl. No. 10/222,304, filed Aug. 2002, Sarigiannis et al.

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