Arc-sprayed shield for pre-sputter etching chamber

Details Arc-sprayed shield for pre-sputter etching chamber Arc-sprayed shield for pre-sputter etching chamber

2005-09-13

2005-09-13

McDonald, Rodney G. (Department: 1753)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S298310, C427S456000

Reexamination Certificate

active

06942764

ABSTRACT:
Contamination due to deposited particulate matter has been greatly reduced in single wafer sputter-etchers by coating the full interior of the sputtering shield with a layer of an arc-sprayed material such as aluminum, said layer being possessed of a high degree of surface roughness. The method for forming the coating of arc-sprayed aluminum is described and data comparing particulate contaminant count and product yield before and after the adoption of the present invention, are presented.

REFERENCES:
patent: 3661761 (1972-05-01), Koenig
patent: 4298443 (1981-11-01), Maydan
patent: 4320251 (1982-03-01), Narasimhan et al.
patent: 4414069 (1983-11-01), Cuomo
patent: 4419201 (1983-12-01), Levinstein et al.
patent: 5135629 (1992-08-01), Sawada et al.
patent: 5482612 (1996-01-01), Armstrong et al.
patent: 05-247634 (1993-09-01), None
Maissel et al, in the IBM Journal of Research and Development vol 14 p 176, Mar. 1970.

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