Apparatus for uniformly etching a dielectric layer

Details Apparatus for uniformly etching a dielectric layer Apparatus for uniformly etching a dielectric layer

2008-01-08

2008-01-08

Lund, Jeffrie R (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

Having glow discharge electrode gas energizing means

C118S715000, C118S7230ER, C156S345340, C156S345430

Reexamination Certificate

active

07316761

ABSTRACT:
Apparatus for plasma etching a layer of material upon a substrate comprising an anode having a first region protruding from a second region, wherein the second region defines a plane and the first region extends from said plane. In one embodiment, at least one solenoid is disposed near the apparatus to magnetize the plasma.

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Full copy of Korean Patent Publication 2001-00019302 originally cited in IDS of Jun. 2003.
Translation of Korean Patent 1020010019302.

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