Apparatus for transferring wafer and ring

Details Apparatus for transferring wafer and ring Apparatus for transferring wafer and ring

2006-05-23

2006-05-23

Dillon, Jr., Joe (Department: 3651)

Material or article handling

Chamber of a type utilized for a heating function and...

Including driven device and/or inclined flow path to carry...

C118S725000, C392S418000

Reexamination Certificate

active

07048488

ABSTRACT:
For wafer processing, wafers are transferred between a thermal treatment chamber and a thermal treatment installation. The treatment chamber has a top section and a bottom section between which the wafer is accommodated during treatment. The thermal treatment installation has a loading chamber having loading means and transport means. The wafer is place on a wafer support while in the loading chamber, wherein the wafer support is configured as a ring having support elements to support the wafer. The wafer support loaded with the wafer is inserted into the thermal treatment chamber so that the wafer and the wafer support are positioned between the top section and the bottom section. The wafer is individually processed in the thermal treatment chamber. After processing the wafer, the wafer support is removed from the thermal treatment chamber.

REFERENCES:
patent: 3947236 (1976-03-01), Lasch, Jr.
patent: 4468259 (1984-08-01), Mimura
patent: 4495024 (1985-01-01), Bok
patent: 4575408 (1986-03-01), Bok
patent: 4738748 (1988-04-01), Kisa
patent: 4860687 (1989-08-01), Frijlink
patent: 5162047 (1992-11-01), Wada et al.
patent: 5592581 (1997-01-01), Okase
patent: 5711811 (1998-01-01), Suntola et al.
patent: 5788425 (1998-08-01), Skow et al.
patent: 5820367 (1998-10-01), Osawa
patent: 5879459 (1999-03-01), Gadgil et al.
patent: 5897311 (1999-04-01), Nishi
patent: 5983906 (1999-11-01), Zhao et al.
patent: 6100505 (2000-08-01), Pike
patent: 6111225 (2000-08-01), Ohkase et al.
patent: 6167834 (2001-01-01), Wang et al.
patent: 6168668 (2001-01-01), Yudovsky
patent: 6228171 (2001-05-01), Shirakawa
patent: 6280183 (2001-08-01), Mayur et al.
patent: 6325858 (2001-12-01), Wengert et al.
patent: 6329304 (2001-12-01), Kuznetsov et al.
patent: 6344632 (2002-02-01), Yu et al.
patent: 6347919 (2002-02-01), Ryan et al.
patent: 6355909 (2002-03-01), Griffiths et al.
patent: 6399922 (2002-06-01), Okase et al.
patent: 6462411 (2002-10-01), Watanabe et al.
patent: 6551404 (2003-04-01), Snijders et al.
patent: 6554906 (2003-04-01), Kuibira et al.
patent: 6559039 (2003-05-01), Wang et al.
patent: 6561798 (2003-05-01), Kuznetsov et al.
patent: 6719499 (2004-04-01), Kuznetsov et al.
patent: 6753508 (2004-06-01), Shirakawa
patent: 6776849 (2004-08-01), Aggarwal et al.
patent: 6805749 (2004-10-01), Granneman et al.
patent: 6824619 (2004-11-01), Kuznetsov et al.
patent: 0 405 301 (1991-01-01), None
patent: 0 821 403 (1998-01-01), None
patent: 2 199 022 (1988-06-01), None
patent: JP 63-136532 (1968-08-01), None
patent: 63-136532 (1986-11-01), None
patent: WO 98/01890 (1998-01-01), None

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