Apparatus for testing semiconductor wafer

Details Apparatus for testing semiconductor wafer Apparatus for testing semiconductor wafer

1996-04-25

2000-10-17

Karlsen, Ernest

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324765, G01R 1073, G01R 3128

Patent

active

061337447

ABSTRACT:
The present invention provides a semiconductor wafer tester including a substrate, at least one chip mounted on an upper surface of the substrate, the chip having function as a tester, the chip being electrically connected to a contact formed on a lower surface of the substrate through an internal wiring formed in the substrate, and a contact film having at least one first bump formed on an upper surface thereof and at least one second bump formed on a lower surface thereof, the first bump being electrically connected to the second bump through an internal wiring formed throughout the contact film, the contact film being to be disposed to be sandwiched between the substrate and a semiconductor wafer to be tested so that the first bump is in electrical contact with the contact of the substrate and the second bump is in electrical contact with the semiconductor wafer. The tester makes it possible to carry out high frequency test concurrently for a plurality of semiconductor wafers in a shorter period of time with lower costs.

REFERENCES:
patent: 5070297 (1991-12-01), Kwon et al.
patent: 5408190 (1995-04-01), Wood et al.
patent: 5574382 (1996-11-01), Kimura
patent: 5701666 (1997-12-01), DeHaven
M. Sugimoto et al., "Ultra High Density Anisotropic Conductive Film", Nitto Technical Report, vol. 30, No. 1, May 1992, pp. 45-47.

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