Apparatus for inner lead bonding (ILB) comprising a heat dissipa

Details Apparatus for inner lead bonding (ILB) comprising a heat dissipa Apparatus for inner lead bonding (ILB) comprising a heat dissipa

1995-07-31

1997-08-26

Ramsey, Kenneth J.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228 62, 22818022, 228222, H01L 2158

Patent

active

056603185

ABSTRACT:
An inner lead bonding apparatus having a heat dissipation plate attached to inner leads and to a support for upholding a lead frame of a tape automated bonding package. The heat dissipation plate is, during performance of an inner lead bonding process, located near the bonding interface of bumps formed on a semiconductor chip or on the inner leads and the inner leads, and includes a fastener for fixing itself to the support and elliptical bolt holes for enabling its contact position to the inner leads to be controllable.

REFERENCES:
patent: 4051508 (1977-09-01), Sato et al.
patent: 4060828 (1977-11-01), Satonaka
patent: 4244002 (1981-01-01), Sato et al.
patent: 5120391 (1992-06-01), Ishida
Lau, et al: "Overview of Tape Automated Bonding Technology", Electronic Materials Handbook vol. 1, Packaging, pp. 275, 277, 281 & 288.

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