4. Metal fusion bonding
  5. Process
  6. With condition responsive, program, or timing control

Tae Koo Lee

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Apparatus for inner lead bonding (ILB) comprising a heat dissipa

Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent

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Vertical semiconductor device package having printed circuit...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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