4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Tae Gyeong Chung

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Apparatus and method for containing semiconductor chips to...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Apparatus for inner lead bonding (ILB) comprising a heat dissipa

Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent

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Chip-size package (CSP) using a multi-layer laminated lead frame

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Profile ID: LFUS-PAI-P-403374

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