Apparatus for improving incoming and outgoing wafer...

Details Apparatus for improving incoming and outgoing wafer... Apparatus for improving incoming and outgoing wafer...

2007-06-25

2010-06-01

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

Optical characteristic sensed

Reexamination Certificate

active

07727782

ABSTRACT:
An apparatus and method for inspecting wafers at a reclaim factory is described. Embodiments of the invention describe an apparatus in which a wafer ID and wafer thickness may be simultaneously measured. A wafer is placed onto a sloped surface and positioned by aligning a notch in the wafer with a pin located on the surface, and by propping the wafer against a pair of laterally opposite restraints. In one embodiment, a foot-switch is used to trigger the simultaneous wafer ID and wafer thickness measurements.

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