Coating apparatus – Gas or vapor deposition – With treating means
Reexamination Certificate
2006-08-08
2006-08-08
Hassanzadeh, Parviz (Department: 1763)
Coating apparatus
Gas or vapor deposition
With treating means
Reexamination Certificate
active
07086347
ABSTRACT:
A plasma processing chamber for processing a substrate to form electronic components thereon is disclosed. The plasma processing chamber includes a plasma-facing component having a plasma-facing surface oriented toward a plasma in the plasma processing chamber during processing of the substrate, the plasma-facing component being electrically isolated from a ground terminal. The plasma processing chamber further includes a grounding arrangement coupled to the plasma-facing component, the grounding arrangement including a first resistance circuit disposed in a first current path between the plasma-facing component and the ground terminal. The grounding arrangement further includes a RF filter arrangement disposed in at least one other current path between the plasma-facing component and the ground terminal, wherein a resistance value of the first resistance circuit is selected to substantially eliminate arcing between the plasma and the plasma-facing component during the processing of the substrate.
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Bailey III Andrew D.
Berney Butch
Howald Arthur M.
Kuthi Andras
Crowell Michelle
Hassanzadeh Parviz
IP Strategy Group, P.C.
Lam Research Corporation
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