Apparatus and methods for detecting transitions of wafer...

Details Apparatus and methods for detecting transitions of wafer... Apparatus and methods for detecting transitions of wafer...

2005-08-30

2005-08-30

Paladini, Albert W. (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S195000, C451S006000, C451S007000

Reexamination Certificate

active

06937915

ABSTRACT:
In chemical mechanical polishing apparatus, a wafer carrier plate is provided with a cavity for reception of a sensor positioned very close to a wafer to be polished. Energy resulting from contact between a polishing pad and an exposed surface of the wafer is transmitted only a very short distance to the sensor and is sensed by the sensor, providing data as to the nature of properties of the exposed surface of the wafer, and of transitions of those properties. Correlation methods provide graphs relating sensed energy to the surface properties, and to the transitions. The correlation graphs provide process status data for process control.

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