4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

David J. Hemker

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Apparatus and methods for controlling wafer temperature in...

Semiconductor device manufacturing: process – Including control responsive to sensed condition – Optical characteristic sensed
Reexamination Certificate

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Apparatus and methods for detecting transitions of wafer...

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing
Reexamination Certificate

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Apparatus for controlling wafer temperature in chemical...

Abrading – Precision device or process - or with condition responsive... – Controlling temperature
Reexamination Certificate

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Apparatus methods for controlling wafer temperature in...

Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate

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Low pressure anisotropic etch process for tantalum silicide or t

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
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Profile ID: LFUS-PAI-P-1815038

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