Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus
Reexamination Certificate
2011-07-05
2011-07-05
Gramaglia, Maureen (Department: 1716)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
C118S7230AN
Reexamination Certificate
active
07972467
ABSTRACT:
An apparatus configured to confine a plasma within a processing region in a plasma processing chamber. In one embodiment, the apparatus includes a ring that has a baffle having a plurality of slots and a plurality of fingers. Each slot is configured to have a width less than the thickness of a plasma sheath contained in the processing region.
REFERENCES:
patent: 4793282 (1988-12-01), Greenberg et al.
patent: 6093281 (2000-07-01), Wise et al.
patent: 6129808 (2000-10-01), Wicker et al.
patent: 6551447 (2003-04-01), Savas et al.
patent: 6733620 (2004-05-01), Sugiyama et al.
patent: 2001/0014540 (2001-08-01), Shan et al.
patent: 2003/0092278 (2003-05-01), Fink
Mesh. Academic Press Dictionary of Science and Technology (1992). Retrieved Sep. 27, 2006, from xreferplus. http://www.xreferplus.com/entry/3128989.
Office Action dated Oct. 8, 2008 for U.S. Appl. No. 12/201,156.
Office Action dated Feb. 5, 2009 for U.S. Appl. No. 11/924,086.
Office Action dated Apr. 22, 2009 for U.S. Appl. No. 12/201,156.
Bera Kallol
Buchberger, Jr. Douglas A.
Carducci James D.
Hoffman Daniel J.
Shannon Steven C.
Applied Materials Inc.
Gramaglia Maureen
Patterson & Sheridan L.L.P.
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