Apparatus and method to confine plasma and reduce flow...

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus

Reexamination Certificate

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C118S7230AN

Reexamination Certificate

active

07972467

ABSTRACT:
An apparatus configured to confine a plasma within a processing region in a plasma processing chamber. In one embodiment, the apparatus includes a ring that has a baffle having a plurality of slots and a plurality of fingers. Each slot is configured to have a width less than the thickness of a plasma sheath contained in the processing region.

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Office Action dated Oct. 8, 2008 for U.S. Appl. No. 12/201,156.
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