Apparatus and method for verifying the coplanarity of a ball gri

Optics: measuring and testing – By configuration comparison – With comparison to master – desired shape – or reference voltage

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356237, 348126, G01B 1100

Patent

active

056215304

ABSTRACT:
The apparatus (10) includes a flat transparent surface (30) and two angled mirrored surfaces (32, 34) which direct the light to the ball grid array (12) on the underside of the semiconductor device (14) positioned on the flat transparent surface (30) in a live bug mode. The mirrored surfaces (32, 34) also direct the image of the ball grid array (12) to an image capturer (18) such as a video camera. The focus information of each solder ball is used to determine the distance to the tips of each solder ball. The coplanarity of the ball grid array can then be determined and/or verified.

REFERENCES:
patent: 5015096 (1991-05-01), Kowalski et al.
patent: 5450206 (1995-09-01), Caillat et al.
patent: 5465152 (1995-11-01), Bilodeau et al.

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