Optics: measuring and testing – By polarized light examination – Of surface reflection
Reexamination Certificate
2005-10-27
2010-02-09
Turner, Samuel A (Department: 2877)
Optics: measuring and testing
By polarized light examination
Of surface reflection
Reexamination Certificate
active
07659981
ABSTRACT:
A system for probing a DUT is disclosed, the system having a pulsed laser source, a CW laser source, beam optics designed to point a reference beam and a probing beam at the same location on the DUT, optical detectors for detecting the reflected reference and probing beams, and a collection electronics. The beam optics is a common-path polarization differential probing (PDP) optics. The common-path PDP optics divides the incident laser beam into two beams of orthogonal polarization—one beam simulating a reference beam while the other simulating a probing beam. Both reference and probing beams are pointed to the same location on the DUT. Due to the intrinsic asymmetry of a CMOS transistor, the interaction of the reference and probing beams with the DUT result in different phase modulation in each beam. This difference can be investigated to study the response of the DUT to the stimulus signal.
REFERENCES:
patent: 3524694 (1970-08-01), Klein et al.
patent: 3711186 (1973-01-01), O'Connor
patent: 3912378 (1975-10-01), Goto
patent: 4297032 (1981-10-01), Temple
patent: T102104 (1982-08-01), Kirk et al.
patent: 4353618 (1982-10-01), Hagner et al.
patent: 4555767 (1985-11-01), Case et al.
patent: 4588950 (1986-05-01), Henley
patent: 4615620 (1986-10-01), Noguchi et al.
patent: 4625114 (1986-11-01), Bosacchi et al.
patent: 4634234 (1987-01-01), Baumann
patent: 4680635 (1987-07-01), Khurana
patent: 4681449 (1987-07-01), Bloom et al.
patent: 4698587 (1987-10-01), Burns et al.
patent: 4721910 (1988-01-01), Bokor et al.
patent: 4724322 (1988-02-01), Knowles et al.
patent: 4736159 (1988-04-01), Shiragasawa et al.
patent: 4758092 (1988-07-01), Heinrich et al.
patent: 4758786 (1988-07-01), Hafeman
patent: 4811090 (1989-03-01), Khurana
patent: 4908568 (1990-03-01), Gerald
patent: 4956603 (1990-09-01), Russo
patent: 4968932 (1990-11-01), Baba et al.
patent: 5004307 (1991-04-01), Kino et al.
patent: 5010945 (1991-04-01), Burke
patent: 5087121 (1992-02-01), Kakuchi et al.
patent: 5164664 (1992-11-01), Soelkner
patent: 5208648 (1993-05-01), Batchelder et al.
patent: 5220403 (1993-06-01), Batchelder et al.
patent: 5247392 (1993-09-01), Plies
patent: 5282088 (1994-01-01), Davidson
patent: 5334540 (1994-08-01), Ishii
patent: 5412328 (1995-05-01), Male et al.
patent: 5430305 (1995-07-01), Cole, Jr. et al.
patent: 5453994 (1995-09-01), Kawamoto et al.
patent: 5457536 (1995-10-01), Kornfield et al.
patent: 5465043 (1995-11-01), Sakai
patent: 5475316 (1995-12-01), Hurley et al.
patent: 5493236 (1996-02-01), Ishii et al.
patent: 5532607 (1996-07-01), Inuzuka et al.
patent: 5532873 (1996-07-01), Dixon
patent: 5854804 (1998-12-01), Winer et al.
patent: 5872360 (1999-02-01), Paniccia et al.
patent: 5905577 (1999-05-01), Wilsher et al.
patent: 5930588 (1999-07-01), Paniccia
patent: 5940545 (1999-08-01), Kash et al.
patent: 5969517 (1999-10-01), Rao
patent: 6072179 (2000-06-01), Paniccia et al.
patent: 6168311 (2001-01-01), Xiao et al.
patent: 6188705 (2001-02-01), Krainak et al.
patent: 6251706 (2001-06-01), Paniccia
patent: 6252222 (2001-06-01), Kasapi et al.
patent: 6252412 (2001-06-01), Talbot et al.
patent: 6297651 (2001-10-01), Akikuni et al.
patent: 6445198 (2002-09-01), Akikuni et al.
patent: 6452378 (2002-09-01), Toriyama et al.
patent: 6462814 (2002-10-01), Lo
patent: 6509750 (2003-01-01), Talbot et al.
patent: 6591121 (2003-07-01), Madarasz et al.
patent: 6594086 (2003-07-01), Pakdaman et al.
patent: 6605951 (2003-08-01), Cowan
patent: 6621275 (2003-09-01), Cotton et al.
patent: 6720588 (2004-04-01), Vickers
patent: 6778327 (2004-08-01), Pakdaman et al.
patent: 6788396 (2004-09-01), Stolte et al.
patent: 6797581 (2004-09-01), Vickers
patent: 6798562 (2004-09-01), Hakimi et al.
patent: 6812464 (2004-11-01), Sobolewski et al.
patent: 6836131 (2004-12-01), Cader et al.
patent: 6897664 (2005-05-01), Bruce et al.
patent: 2004/0001255 (2004-01-01), Fratello
Weingarten et al, Picosecond Optical Sampling of GaAs Integrated Circuits, IEEE Journal of Quantum Electronics, vol. 24, No. 2, Feb. 1988, pp. 198-220.
Yee, W.M., et al., “Laser Voltage Probe (LVP); A Novel Optical Probing Technology for Flip-Chip Packaged Microprocessors,”Conference Proceedings from the 26thInternational Symposium for Testing and Failure Analysis(ISFTA), Nov. 12-16, 2000, pp. 3-8.
Kolachina, S., et al., “Optical Waveform Probing—Strategies for Non-Flipchip Devices and Other Applications,”Conference Proceedings from the 37thInternational Symposium for Testing and Failure Analysis(ISFTA), Nov. 11-15, 2001, pp. 51-57.
International Search Report for PCT/US07/11790 dated Feb. 14, 2008.
Paniccia, Mario, et al., “Novel Optical Probing Technique for Flip Chip Packaged Microprocessors,” International Test Conference, IEEE 1998.
Eiles, Travis M., et al., “Optical Probing of VLSI IC's from the Silicon Backside,”Proceedings from the 25thInternational Symposium for Testing and Failure Analysis, Nov. 14-18, 1999, pp. 27-33.
Bruce, Mike, et al., “Waveform Acquisition from the Backside of Silicon Using Electro-Optic Probing,”Proceedings from the 25International Symposium for Testing and Failure Analysis, Nov. 14-18, 1999, pp. 19-25.
Heinrich, H.K., et al., “Picosecond Backside Optical Detection of Internal Signals in Flip-Chip Mounted Silicon VLSI Circuits,”3rd European Conference on Electron and Optical Beam Testing of Integrated Circuits, Sep. 9-11, 1991, Como, Italy.
Black, A., et al., “Optical Sampling of GHz Charge Density Modulation in Silicon Bipolar Junction Transistors,” Electronics Letters, 1987, vol. 23, No. 15, p. 783-784.
Kasapi, Steven, et al., “Laser Beam Backside Probing of CMOS Integrated Circuits,”Microelectronics Reliability, 1999, pp. 957-961, 39.
Heinrich, H.K., et al., “Noninvasive Sheet Charge Density Probe for Integrated Silicon Devices,”Appl. Phys. Lett. 48 (16), Apr. 21, 1986, American Institute of Physics.
Heinrich, H.K., et al., “Erratum: Noninvasive Sheet Charge Density Probe for Integrated Silicon Devices,”Appl. Phys. Lett. 1986, 48, 1066.
Heinrich, H.K., et al., “Noninvasive Optical Sheet Charge Density Probe for Silicon Integrated Circuits,”IEEE Transactions on Electron Devices, Nov. 1986, vol. Ed. 33 No. 11.
Hemenway, B.R., et al., “Optical Detection of Charge Modulation in Silicon Integrated Circuits Using a Multimode Laser-Diode Probe,”IEEE Electron Device Letters, Aug. 1987, vol. EdL-8, No. 8.
Soref, Richard A., et al., “Electrooptical Effects in Silicon,”IEEE Journal of Quantum Electronics, Jan. 1987, vol. QE-23 No. 1.
Wilsher, Kenneth R., et al., “Practical Optical Waveform Probing of Flip-Chip CMOS Devices,”ITC International Test Conference, Paper 35.1, 1999.
Wilsher, Ken, et al., “Integrated Circuit Waveform Probing Using Optical Phase Shift Detection,”Proceedings from the 26International Symposium for Testing and Failure Analysis, Nov. 12-16, 2000, pp. 479-485, Bellevue, Washington.
Lo, William, et al., “Polarization Difference Probing: A New Phase Detection Scheme for Laser Voltage Probing,”Proceedings from the 30thInternational Symposium for Testing and Failure Analysis, Nov. 14-18, 2004, Worcester, Massachusetts.
Heinrich, H.K., “Picosecond Noninvasive Optical Detection of Internal Electrical Signals in Flip-Chip-Mounted Silicon Integrated Circuits,”IBM J. Res. Development, Mar./May 1990, vol. 34. No. 2/3.
Mertin, W., et al., “Contactless Gigahertz Testing,” Gerhard-Mercator-Universität Duisburg, 1998.
Buller, G.S., et al., “All-Solid-State Microscope-Based System for Picosecond Time-Resolved Photoluminescence Measurements on II-VI Semiconductors,”Rev. Sci. Instrum. 63 (5), May 1992, American Institute of Physics.
Charbonneau, S., et al., “Two-Dimensional Time-Resolved Imaging with 100-ps Resolution Using a Resistive Anode Photomultiplier Tube,”Rev. Sci. lnstrum., 63 (11), Nov. 1992, American Institute of Physic
Boiadjieva Nina
Lo William
Nataraj Nagamani
Wilsher Kenneth
Bach, Esq. Joseph
DCG Systems, Inc.
Nixon & Peabody LLP
Turner Samuel A
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