Apparatus and method for cleaning a semiconductor wafer

Details Apparatus and method for cleaning a semiconductor wafer Apparatus and method for cleaning a semiconductor wafer

2006-08-15

2006-08-15

Kornakov, M. (Department: 1746)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C134S001000, C134S032000, C134S184000, C134S902000

Reexamination Certificate

active

07089947

ABSTRACT:
The apparatus for cleaning a wafer includes an energy concentration relieving member positioned at the side of the wafer. An elongated portion of a probe extends over and substantially parallel to the wafer surface. A vibrator is attached to a rear end of the probe for vibrating the probe such that the elongated portion transfers acoustic vibrational energy to the wafer and dislodges debris.

REFERENCES:
patent: 6039059 (2000-03-01), Bran
patent: 6333268 (2001-12-01), Starov et al.
patent: 6543080 (2003-04-01), Tomita et al.
patent: WO98/14985 (1998-04-01), None
Translation of German Office Action dated Jul. 14, 2005.

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