Apparatus and method for attaining repeatable temperature versus

Details Apparatus and method for attaining repeatable temperature versus Apparatus and method for attaining repeatable temperature versus

1995-09-05

1999-07-20

Housel, James C.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

2041921, 20429801, 20429831, 216 58, 216 63, 216 67, 438689, 438715, C23F 102, C23C 1400, B44C 122, C03C 1500

Patent

active

059252120

ABSTRACT:
The temperatures of scavenger-emitting kit parts in a high-density plasma (HDP) etching system are elevated to or close to respective steady state equilibrium temperatures so that scavenger chemistry and rates remain substantially the same on a wafer-to-wafer basis. A relatively inert warm-up plasma is turned on within the HDP chamber during idle time periods that precede or occur between executions of a predefined plasma-processing recipe so as to raise the temperatures of chamber-internal kit parts.

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