Alignment marks with salicided spacers between bitlines for...

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks

Reexamination Certificate

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C438S401000

Reexamination Certificate

active

07098546

ABSTRACT:
The present invention pertains to utilizing a salicide in establishing alignment marks in semiconductor fabrication. A metal layer is formed over exposed portions of a silicon substrate as well as oxide areas formed over bitlines buried within the substrate. The metal layer is treated to react with the exposed portions of the silicon substrate to form salicided areas. The metal layer does not, however, react with the oxide areas. As such, salicided areas are formed adjacent to the oxide areas to provide an enhanced optical contrast when light is shined there-upon. In this manner, the alignment marks can be more readily “seen”. The enhanced optical contrast thus allows the marks to continue to be seen as scaling occurs.

REFERENCES:
patent: 6342426 (2002-01-01), Li et al.
patent: 6436766 (2002-08-01), Rangarajan et al.
patent: 2004/0145066 (2004-07-01), Swanson et al.
patent: 2004/0212009 (2004-10-01), Wang et al.
Wolf et al., Silicon Processing for the VLSI Era, vol. 2, 2nd edition, Lattice Press, 2000, pp. 268, 606-607, 726.

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