4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With provision for cooling the housing or its contents
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Jang Myungseok

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Jeun O-Seob

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Jian Shin-Tang

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Joiner Bennett

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Joroski Joseph

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Joy Jeremy J

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Kaercher Austin S.

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Kamiyama Daizo

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Kanazawa Takuro

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Kanelis Konstantinos

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Kappes Christopher Max

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Kara Theodore J.

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Katayama Shigeru

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