4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With provision for cooling the housing or its contents

Erik Jung

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active

Electronic circuit arrangement and method for producing an...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Method for producing encapsulated chips

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Method for transfering solder to a device and/or testing the...

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2390089

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