4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With provision for cooling the housing or its contents
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H
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Haga Chris

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Hamano Akihiro

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Han Seong-chan

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Hao Liu

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Harding Sarah K

Examiner

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Hata Toshiyuki

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HCC Aegis, Inc.

Corporate Assignee

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Helke Gunther

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Herbst, II Gerhardt G.

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Herr Egon

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Herrera Alfredo

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Hildbrand Urs

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Hirai Yasuyoshi

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Hirakawa Satoshi

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Hirayama Norio

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Hisamoto Masaaki

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Hochstenbach Hendrik Pieter

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Hoffmann Ingolf

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Honda Yukio

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Honma Takayoshi

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