Ultra-hard low friction coating based on A1MgB 14 for...
Ultra-longlife, high formability brazing sheet
Ultra-thin copper foil with carrier, method of production of...
Ultra-thin nucleation layer for magnetic thin film media and...
Ultrathin copper foil with carrier and printed circuit board...
Under bump metallurgy for Lead-Tin bump over copper pad
Underfill material for COF mounting and electronic components
Underfill sealant of epoxy resins, adhesion promotor and...
Uniform gold films
Unrecrystallized layer and associated alloys and methods
Use of a Ni-base alloy for compound tubes for combustion plants
Use of a steel composition for the production of an...
Use of silver alloys as cadium-free brazing solder