Ultra-thin copper foil with carrier, method of production of...

Details Ultra-thin copper foil with carrier, method of production of... Ultra-thin copper foil with carrier, method of production of...

2005-08-02

2005-08-02

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S612000, C428S618000, C428S655000, C428S660000

Reexamination Certificate

active

06924043

ABSTRACT:
An ultra-thin copper foil with a carrier having a peeling layer able to withstand even high temperature working in the case of using a high heat resistant resin, enabling the carrier foil and the ultra-thin copper foil to be easily peeled apart, and reduced in the number of pinholes by uniform plating without impairing the peelability of the peeling layer, that is, an ultra-thin copper foil with a carrier comprised of a carrier foil, a peeling layer, and an ultra-thin copper foil, wherein the peeling layer and the ultra-thin copper foil are provided between them with a strike plating layer at the surface on the peeling layer side, an ultra-thin layer of copper is provided on this according to need, and an ultra-thin copper foil comprised of copper or a copper alloy or a phosphorus-containing copper or phosphorus-containing copper alloy is provided. The peeling layer between the carrier foil and the ultra-thin copper foil is chromium, a chromium alloy, a chromium-containing oxide hydrate layer, nickel, iron, or an alloy layer of the same or an oxide hydrate layer of the same.

REFERENCES:
patent: 4568413 (1986-02-01), Toth et al.
patent: 5066366 (1991-11-01), Lin
patent: 5262247 (1993-11-01), Kajiwara et al.
patent: 5689879 (1997-11-01), Urasaki et al.
patent: 5709957 (1998-01-01), Chiang et al.
patent: 6346335 (2002-02-01), Chen et al.
patent: 6660406 (2003-12-01), Yamamoto et al.
patent: 1 133 220 (2001-09-01), None
patent: 1 331 088 (2003-07-01), None

Affiliated with

Also associated with

Rating

Ultra-thin copper foil with carrier, method of production of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ultra-thin copper foil with carrier, method of production of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultra-thin copper foil with carrier, method of production of... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3515314