Ultrathin copper foil with carrier and printed circuit board...

Details Ultrathin copper foil with carrier and printed circuit board... Ultrathin copper foil with carrier and printed circuit board...

2011-07-26

2011-07-26

Lam, Cathy (Department: 1784)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S618000, C428S655000, C428S661000, C428S665000, C428S667000, C428S678000

Reexamination Certificate

active

07985488

ABSTRACT:
An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content “a” of the metal A and a content “b” of the metal B forming the release layer satisfying an equation:in-line-formulae description="In-line Formulae" end="lead"?10≦a/(a+b)*100≦70in-line-formulae description="In-line Formulae" end="tail"?and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.

REFERENCES:
patent: 5114543 (1992-05-01), Kajiwara et al.
patent: 6183880 (2001-02-01), Yoshioka et al.
patent: 6346335 (2002-02-01), Chen et al.
patent: 7026059 (2006-04-01), Suzuki et al.
patent: 7132158 (2006-11-01), Brenneman et al.
patent: 7175920 (2007-02-01), Suzuki et al.
patent: 7465829 (2008-12-01), Schneider et al.
patent: 1 331 088 (2003-07-01), None
patent: 1 511 366 (2005-03-01), None
patent: 1 531 656 (2005-05-01), None
patent: 2003-94553 (2003-04-01), None
patent: 03/008671 (2003-01-01), None
patent: 2006/013735 (2006-02-01), None

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